Laser Cutting Machines of a Great Variety--HY Laser
ABOUT US:
HY Laser can serve global users with 20+ kinds of machines that are suitable for most materials needing to be cut, including
sheet metal laser cutting machine, sheet & tube laser cutting machine, tube metal laser cutting machine, bending
machine and welding machine.
Wafer laser cutting machine is specialized for metal and silicon, germanium and other semiconductor substrate materials marking and cutting, is a set of laser, computer, automatic control, precision machinery technology in one of the high-tech products. The machine output laser power, high accuracy, high speed, stable performance, can be round and square and other graphics cutting. Integrated structure, professional, for the power electronics industry silicon wafer circular design. Software based on Chinese and English Windows system, CNC professional cutting and scribing software, powerful. The machine is stable, reliable, easy to operate, with CCD side axis monitoring and positioning, cutting single circle, multi-circle special silicon disc suction cups.
Main Features
1.CNC professional circle cutting software, powerful, stable and reliable operation, simple operation;
2.CCD side axis monitoring and positioning, 40 times magnification positioning accuracy;
3.Visual automatic positioning system integrates professional cutting software, high positioning accuracy, suitable for multi-circle and multi-graphic processing;
4.Large output power, high accuracy, small cutting stress, smooth cutting edge;
5.Small footprint, good beam quality, high cutting efficiency, suitable for mass processing
Technical Parameter
M0del: HY-JY-400
| Laser type |
YAG pulsed laser |
Laser input power |
≤15Kw |
| Maximum laser output power |
400w |
Minimum line width |
0.1-0.3mm |
| Maximum cutting speed |
300-1000mm |
Cutting material thickness |
0.2-5mm |
| Maximum cutting thickness |
2mm(Single crystal silicon) |
X/Y positioning accuracy |
0.02mm/1000mm |
| Cooling mode |
water-cooling |
X/Y repeated positioning accuracy |
0.02mm/1000mm |
| Laser wavelength |
1070mm |
Power allocation |
AC220V,50HZ |
| Cutting range |
300mm*250mm |
Continuous working time |
24 hours |
Company Profile
Main features:
1. High photoelectric conversion efficiency, low energy consumption, saving operating costs, to achieve the highest production efficiency;
2. Fiber laser operation without the use of working gas, no regular maintenance, with low operation and maintenance costs;
3. Use optical fiber transmission, save external optical path lens, stable structure, external optical path maintenance-free, reduce machine failure rate, avoid external optical path loss;
4. Fiber laser cutting machine has obvious advantages in thin plate cutting.
When choosing a laser cutting machine,multiple factors need to be considered,inclding poweer,cutting materials,and cutting quality. You can choose the laser cutting machine that suits you according to your actual needs.Please feel free to contact us at any time.
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