Laser Wafer Cutting System with High-Precision Scribing Technology

• Customization: Available
• After-sales Service: Online Support
• Warranty: One Year
• Model NO.: HY-T-50S
• Condition: New
• Certification: CE, ISO9001
• Standard: GB
• Customized: Customized
• Material: Metal
• Application: Metal Recycling Machine, Metal Cutting Machine, Metal Straightening Machinery, Metal Spinning Machinery, Metal Processing Machinery Parts, Metal forging Machinery, Metal Engraving Machinery, Metal Drawing Machinery, Metal Coating Machinery, Metal Casting Machinery
• Factory Nature: Integration of Industry and Trade
• Product Grade: High-End Customizable Products
• Transport Package: Export Packing
• Trademark: HY laster
• Origin: Wu Han

Product Description

Laser Wafer Cutting System with High-Precision Scribing Technology


Product characteristics
Seal: completely closed table dust-free cutting design model, with purification device, to avoid dust pollution of equipment and environment.
Stability: marble platform, good stability, gantry structure two-dimensional operation translation platform, high precision, fast speed.
Precision: visual mark point recognition and positioning, automatic tracking and cutting.
Tooling: With a professional silicon wafer cutting jig, to ensure that the cutting end face is smooth and the aspect is not damaged.
Precision: The cutting seam width can be up to several wire orders, which is more advantageous for precision silicon wafer ceramic processing.         


Product parameter

Equipment type	HY-T-50S
Wave length	808nm/980nm
Output power	50W/100W
X-axis travel	200mm
Y-axis travel	200mm
Z-axis travel	100mm
Positioning accuracy X/Y/Z	0.02mm
Control mode	Industrial PC,PLC
Mode of movement	Servo drive, multi-axis linkage
Positioning mode	Visual automatic location
Solder joint size	0.2~1mm
Operating station	4-station
Dimensions of the main machine	1300mm×1360mm×1830mm

Product application




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