Advanced Laser Scribing Equipment for Precision Cutting Solutions
Product introduction
Seal: completely closed table dust-free cutting design model, with purification device, to avoid dust pollution of equipment and environment.
Stability: marble platform, good stability, gantry structure two-dimensional operation translation platform, high precision, fast speed.
Precision: visual mark point recognition and positioning, automatic tracking and cutting.
Tooling: With a professional silicon wafer cutting jig, to ensure that the cutting end face is smooth and the aspect is not damaged.
Precision: The cutting seam width can be up to several wire orders, which is more advantageous for precision silicon wafer ceramic processing.
Product parameter
| Equipment type |
HY-PL-200F |
| power |
100W/150W |
| Cooling system |
Air cooling |
| Travel range |
300×300mm |
| Travel range Z |
80mm |
| mount |
High precision marble platform |
| X-Y work platform |
Linear module positioning accuracy±0.003mm |
| Maximum empty speed |
800mm/s |
| Whole machine control system |
Industrial PC |
| Visual system |
Industrial camera |
| Power supply |
AC220V±10%,50Hz |
| Workpiece fixture |
Customized by product |
| Document format |
DXF,GBR,PLT |
| Ambient temperature |
5~30ºC |
| Ambient humidity |
<60% |
| Main engine size |
1050mm×1400mm×1750mm |
Product application
Our factory
Our factory's certificate of honor
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